1.Project Introduction:
With the rapid development of electronic technology, more and more electronic products are assembling denser, smaller and more components on smaller, thinner and more irregular circuit boards. CBA 's splitting process brings greater challenges. For this reason, Hengya provides a more environmentally friendly, fast, precise and reliable laser precision cutting solution to meet the needs of this trend.
Scope of application: It is suitable for micro-processing of various materials, including the cutting of PCB , FPC , flexible and rigid boards (including assembled circuit boards) with a thickness of less than 0.8mm .LLaser Board Splitting Machine
2. Product Features:
1. No stress:
The special carrier cooperates with laser processing, even if the components are very close to the cutting track, there is no stress effect;
2. Precise heat impact control:
According to different heat effect requirements, select the appropriate laser type and cooperate with the appropriate laser processing parameters to minimize the heat effect;
3. Cleaning processing:
Real-time laser soot treatment during processing to minimize the impact of soot on circuit components;
4. Multifunctional:
It is not only suitable for precision cutting and drilling of flexible boards, rigid boards and flexible-rigid combination boards of various thicknesses, but also for cutting and drilling of other materials such as glass, ceramics, thin metal plates, etc.;
5. Security:
The processing area is fully enclosed to ensure the safety protection of the processing process; it is designed in accordance with the electrical standards of China and the European Union;
6. Automation:
Reserve open ports for easy adaptation to power management and control systems, automated loading and unloading systems, and MES systems
Suitable for all kinds of automation needs;
7. High speed and high precision:
High-speed, high-precision X/Y/Z movement system , perfect precision compensation mechanism, including single-axis precision compensation, plane precision compensation, scanning area precision compensation , motion control system with coaxial CCD positioning system, to ensure high-speed and high-precision machining process ;
8. High degree of freedom:
A variety of nanosecond and picosecond UV and green lasers are available to meet various processing needs;
9. Simple and fast operation:
The software interface is concise, compatible with industry conventional data formats, easy to operate and user-friendly;
10. Power detection system:
Optional power online detection system to ensure stable power and maintain the consistency of cutting quality;